3D Convergence of Multi-board PCB and IC Packaging Design
Traditional 2D PCB-centric design processes are constraining today’s highly competitive product development processes. As products become smaller, faster, lighter with more complex shapes the development process must evolve to accommodate a product-centric perspective.
- Multi-board design challenges
- 3D design challenges
- 3D design tools address multi-board design
- Chip-package-board co-design
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