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3D Convergence of Multi-board PCB and IC Packaging Design Follow

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    cameraTraditional 2D PCB-centric design processes are constraining today’s highly competitive product development processes. As products become smaller, faster, lighter with more complex shapes the development process must evolve to accommodate a product-centric perspective.

    Topics:

    • Multi-board design challenges
    • 3D design challenges
    • 3D design tools address multi-board design
    • Chip-package-board co-design
    • Simulation

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