Toshiba faced a difficult design problem: their TransferJet™ technology was embedded in a customer cell phone, and when the next rev of the phone came around, they learned that they needed to shrink the board from 8mm x 8mm to 4.5mm x 6mm, and they had to shrink the module thickness from 1.7mm to 1.0mm.
The original design was a simple board with a wire bond package and several peripherals. Competitive pressures required a significant reduction in size and thickness. On top of that, they had to add RF matching to simplify the adoption of the module. Toshiba used Zuken’s CR-8000 Design Force with ANSYS analysis tools to accomplish the project.