If you are using a PCB-centric design process - you are falling behind. PCB-centric design processes don't address the needs of a modern collaborative product-centric process. In many cases the product contains more than one PCB and an enclosure design that leaves little room if any for unused space. A 3D multi-discipline process involving PCB, mechanical and supply chain is needed.
The design process needs to evolve to keep up with today’s product requirements that involve size, cost and style. Game changing technologies such as System on a Chip (SoC), touch sensing and display technology, and complex enclosure designs are all significantly impacting product design. From initial planning through to detail design, concurrent product-level development of the PCB(s) and enclosure is no longer optional, it is a requirement. This next generation process is challenging engineering teams to solve complex product development issues in both 2D and 3D within their core tool suite as expeditiously as possible.
This webinar will discuss and demonstrate the key concepts behind a 3D multi-discipline design where supplychain, PCB, MCAD and analysis all converge into a next generation design process.